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Connector Interposer for Module To Board Electrical Interconnection

IP.com Disclosure Number: IPCOM000077554D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Agard, RL: AUTHOR [+3]

Abstract

This is a bottomless solder bucket interconnector device 10 having an array of electrically isolated through-holes 11 in it. The basic member 10 may be fabricated from a ceramic, reinforced plastic, or a metal material. If a ceramic or plastic material is used, the through-holes 11 are metallized with a readily solderable metal such as copper or nickel. If a metal material is used for the base member, the holes are first coated with an insulative material and then metallized with copper or nickel. Alternatively, a discrete eyelet may be used to accomplish the through-hole metallization. The through-holes 11 in the interconnector member are filled with solder 12 which may be accomplished by a solder wave, solder fountain or immersion solder processes.

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Connector Interposer for Module To Board Electrical Interconnection

This is a bottomless solder bucket interconnector device 10 having an array of electrically isolated through-holes 11 in it. The basic member 10 may be fabricated from a ceramic, reinforced plastic, or a metal material. If a ceramic or plastic material is used, the through-holes 11 are metallized with a readily solderable metal such as copper or nickel. If a metal material is used for the base member, the holes are first coated with an insulative material and then metallized with copper or nickel. Alternatively, a discrete eyelet may be used to accomplish the through-hole metallization. The through-holes 11 in the interconnector member are filled with solder 12 which may be accomplished by a solder wave, solder fountain or immersion solder processes.

To effect electrical connections through the interconnector device 10 so as to electrically connect the pins 13 of the module 14 with the connector pins 15 of a printed circuit board 16, the solder 12 in the through-holes must be reflowed. The heat source to reflow the solder in the holes may be an integral part of the interconnector or an externally applied heat source. If the interconnector member 10 is fabricated from a ceramic or plastic material, an integral heater 17 is desirable so that good temperature uniformity may be achieved. If a metal plate is used for the interconnector member 10, an external heat source can be applied to reflow the so...