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Glass Layer Fabrication

IP.com Disclosure Number: IPCOM000077562D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Best, B: AUTHOR [+2]

Abstract

The drawing illustrates steps in an improvement of forming a layer of glass on a circuit device. The intermediate steps shown in Fig. 1 uses a commercially available tape that has a glass frit layer formed on a supporting plastic sheet. A layer of adhesive is applied to the glass frit layer and the tape is applied to a suitable support. The structure of Fig. 1 is fired in air at a temperature high enough to remove the organic binders in the tape and to partially sinter the glass. The temperature is kept low enough so that when the structure is cooled the glass shrinks away from the support.

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Glass Layer Fabrication

The drawing illustrates steps in an improvement of forming a layer of glass on a circuit device. The intermediate steps shown in Fig. 1 uses a commercially available tape that has a glass frit layer formed on a supporting plastic sheet. A layer of adhesive is applied to the glass frit layer and the tape is applied to a suitable support. The structure of Fig. 1 is fired in air at a temperature high enough to remove the organic binders in the tape and to partially sinter the glass. The temperature is kept low enough so that when the structure is cooled the glass shrinks away from the support.

The glass sheet can be handled with ease and as Fig. 2 shows, it is placed on a circuit device that is to receive a glass coating. The structure of Fig. 2 is fired in a conventional manner in a reducing atmosphere to form a glass layer on the circuit device.

This method is easily automated to produce various glass configurations with high yield at low cost, and it avoids the contamination of the glass by the organic binders that are used in conventional glass slurries.

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