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Patterned Mesh/Screening Masks

IP.com Disclosure Number: IPCOM000077566D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Grosso, JA: AUTHOR [+3]

Abstract

The method described in the IBM Technical Disclosure Bulletin Vol. 15, No. 3, August 1972, page 924, for making laminate screening masks for The method described in the IBM Technical Disclosure Bulletin Vol. 15, No. 3, August 1972, page 924, for making laminate screening masks for conductive pastes is subject to improvement by the following expedient. The mesh configuration need not be formed to span the 1 oz copper screening layer of the laminate, but instead may be confined selectively to areas registered (coincident) with cavity patterns of the opposite 2 oz copper support layer.

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Patterned Mesh/Screening Masks

The method described in the IBM Technical Disclosure Bulletin Vol. 15, No. 3, August 1972, page 924, for making laminate screening masks for The method described in the IBM Technical Disclosure Bulletin Vol. 15, No. 3, August 1972, page 924, for making laminate screening masks for conductive pastes is subject to improvement by the following expedient. The mesh configuration need not be formed to span the 1 oz copper screening layer of the laminate, but instead may be confined selectively to areas registered (coincident) with cavity patterns of the opposite 2 oz copper support layer.

To accomplish this the artwork master for the cavity patterns is used to construct a mesh or grid patterned submaster (on film or glass). In a dual exposure sequence, the sensitive medium from which the submaster is made receives successive exposures to area coincident cavity and mesh or grid artwork. The submaster then is used to expose the resist-coated 1 oz copper side of the laminate for photoetch processing, while the master continues to be used to expose the opposite side of the laminate for photoetch processing.

Resultant laminate screen masks have greater strength in the mesh or grid configured layer and are subject to reduced cost of fabrication (less area to expose, fewer process steps, etc.). The submaster artwork formed by the above technique can also be used to make selective configurations of mesh openings in single layers, which then can b...