Browse Prior Art Database

Substrate Heater Manipulator for Ultraclean Evaporation

IP.com Disclosure Number: IPCOM000077604D
Original Publication Date: 1972-Aug-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Harder, AR: AUTHOR [+2]

Abstract

During vacuum deposition of metal on silicon wafers, close control of the wafer temperature and maintenance of cleanliness of the environment are desirable. Also, it is required in some deposition processes that the angle of the wafer be varied as a means of reducing thin metal areas around sharp, undercut or shadowed areas. The illustrated apparatus provides enclosed substrate heaters and temperature sensors and provides rotary tilting of the substrate mounting surface within the vacuum chamber, by apparatus which is largely located outside the vacuum chamber for ease in pumping down the chamber and maintenance of cleanliness within the chamber.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 59% of the total text.

Page 1 of 2

Substrate Heater Manipulator for Ultraclean Evaporation

During vacuum deposition of metal on silicon wafers, close control of the wafer temperature and maintenance of cleanliness of the environment are desirable. Also, it is required in some deposition processes that the angle of the wafer be varied as a means of reducing thin metal areas around sharp, undercut or shadowed areas. The illustrated apparatus provides enclosed substrate heaters and temperature sensors and provides rotary tilting of the substrate mounting surface within the vacuum chamber, by apparatus which is largely located outside the vacuum chamber for ease in pumping down the chamber and maintenance of cleanliness within the chamber.

Wall 10 of the vacuum chamber has a port 12 in which is mounted a collar
14. Collar 14 mounts a spherical bearing 16 by which tube 18 is journaled for angular motion. The vertical position of 18 is maintained by thrust collar 20. The desired angular motion is imparted to 18 by a second spherical bearing 22 journaled in an eccentric 24. 24 is rotated about its vertical axis by worm 26 by the power of variable-speed motor 28.

The lower end of tube 18 mounts a solid metal conical hub 30 which in turn mounts a stage plate 32, which carries the wafers, not shown, to be metallized. Hub 30 has a quench coil 34 for controlled cooling rate and is bored at 36, 38 to receive cartridge heaters and a thermocouple, respectively. The wiring for the cartridge heaters and thermocoup...