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Inhibiting Adhesion of Silicon Particles to the Surface of a Silicon Semiconductor Wafer During Laser Dicing

IP.com Disclosure Number: IPCOM000077652D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bakhru, N: AUTHOR [+2]

Abstract

Many attempts have been made to prevent adhesion of condensed or solidified material from a laser dicing operation from adhering to the surface of a semiconductor wafer. The most notable attempt has been to use a nylon coating to mask the surface of the wafer. Thermal effects, however, from the laser result in degradation of the coating leading to cross-linking and rendering the nylon difficult to remove.

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Inhibiting Adhesion of Silicon Particles to the Surface of a Silicon Semiconductor Wafer During Laser Dicing

Many attempts have been made to prevent adhesion of condensed or solidified material from a laser dicing operation from adhering to the surface of a semiconductor wafer. The most notable attempt has been to use a nylon coating to mask the surface of the wafer. Thermal effects, however, from the laser result in degradation of the coating leading to cross-linking and rendering the nylon difficult to remove.

By utilizing a coating comprised of homopolymers or copolymers of methacrylate or acrylate monomers including both esters and acids, the resulting coating will not only protect the surface from deposition, but will depolymerize and vaporize in the area adjacent to the laser cut. Additionally, such a coating tends not to cross-link so that removal later by solvent rinsing is effective.

For example, a 15% solids solution of PLEXIGLAS* A-100 was made up in xylene; spun on the wafers at 1500 rpm for 30 seconds so as to make the coating on the surface of the wafer uniform; baked at 80 degrees C for 10 minutes; then laser diced. After dicing the coating was easily removed by a 10 minute wash in a 1/1 isopropanol-trichloroethylene solution under ultrasonic agitation. The diced semiconductor elements or chips came out clean with no organic or inorganic residues remaining. * Trademark of Rohm & Haas Company.

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