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AC Test Probe

IP.com Disclosure Number: IPCOM000077684D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Markewycz, Z: AUTHOR [+2]

Abstract

Probes for performing DC tests are arranged in arrays to contact pad configurations on a semiconductor device. This probe when used in an array, permits AC tests to be performed and also improves the DC probing on a lead-tin pad system.

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AC Test Probe

Probes for performing DC tests are arranged in arrays to contact pad configurations on a semiconductor device. This probe when used in an array, permits AC tests to be performed and also improves the DC probing on a lead-tin pad system.

The probe assembly consists of a round tungsten probe 1 approximately eight mils in diameter, which is tapered down to approximately three mils at its tip 2 (rhodium plated for good contact interface). Probe 1 is cast in a dielectric compound 3 which is held by assembly ground plane 4 formed of holding element 5. Holder 5 may be formed of brass. A bypass capacitor 7 is contained within holder 5 and is secured to probe 1 and to the ground plane formed of holder 5.

End 8 of probe 1 is formed of nickel plate to facilitate the soldering of a coaxial cable 9, which is suitably coupled at 10 to the ground plane formed by holder 5. To permit the probe to be arranged in an array, a mounting hole 11 is formed in holder 5. The AC characteristics for a round probe are achieved by placing the probe at a specified height above the ground plane. A dielectric material with constant E is cast around the probe. Proper contact force is achieved by controlling the distance D of the probe tip from the holder 5.

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