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Solder Paste Application

IP.com Disclosure Number: IPCOM000077738D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Chapin, FW: AUTHOR

Abstract

Solder paste is applied at the base of circuit board pins in metered amounts by a plunger having limited travel.

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Solder Paste Application

Solder paste is applied at the base of circuit board pins in metered amounts by a plunger having limited travel.

Pins 1 in circuit board 2 are secured in position with throughholes 3, by reflowing solder paste at the hole-pin junction. The applied paste is forced through ducts 4 in two opposing nozzles 5 for each pin from reservoir 6. When paste is to be applied, plunger 7 is depressed forcing a fixed amount of paste against the base of the pin. Spring 8 returns the plunger to its retracted position. Additional solder paste is forced into the reservoir by a pressurized supply in common duct 9.

The pins in a board are provided with solder paste by successively moving the nozzles from row-to-row. Two rows of nozzles are shown, with each row coating alternate pins in the row. Adjacent nozzles are offset with respect to each other because of the close proximity of the pins. The use of solder paste eliminates the need of forming and applying solder rings.

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