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Bondable Conductive Tape

IP.com Disclosure Number: IPCOM000077783D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Bunch, AD: AUTHOR [+5]

Abstract

A tape can be made of conductive plastic such as carboxylated polyethelene* or carbon filled thermoplastic in a suitable thickness and a range of widths. The tape thus formed is conductive and bondable by heat without adhesive. If desired, the shielding capability of the tape can be increased by prelaminating metal foil, not shown, on one of its surfaces.** For protection of the foil, it is best applied to the inner surface of the tape. In any case, the foil strip may be narrower than the tape to leave foil free heat bondable edges on the tape.

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Bondable Conductive Tape

A tape can be made of conductive plastic such as carboxylated polyethelene* or carbon filled thermoplastic in a suitable thickness and a range of widths. The tape thus formed is conductive and bondable by heat without adhesive. If desired, the shielding capability of the tape can be increased by prelaminating metal foil, not shown, on one of its surfaces.** For protection of the foil, it is best applied to the inner surface of the tape. In any case, the foil strip may be narrower than the tape to leave foil free heat bondable edges on the tape.

This tape 10 can be used to terminate the braid shield 12 of a shielded cable
14. The tape is wrapped around the exposed end of 12 and continued at 16 to enclose the exposed wiring 18 at the cable end. Bonding can be accomplished conveniently by use of a heat gun.

A length of 16 can be left free to provide a separate grounding strap, or a wire, not shown, can be inserted between the tape and the exposed cable shield for this purpose. The free end of 16 can be attached to a grounding location via a pressure contact such as a screw, or semipermanently bonded to the grounding location with heat. *IBM Technical Disclosure Bulletin, Vol. 14, No. 10, 3/31/72, page 2692. **IBM Technical Disclosure Bulletin, Vol. 15, No. 1, 6/30/72, page 36.

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