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Activated, Noncorrosive, Water Soluble Flux

IP.com Disclosure Number: IPCOM000077812D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Denk, HH: AUTHOR

Abstract

A water-soluble flux for soldering processes is formulated as follows: Organic acid 1%-10% Water 5%-15% Glycol 10%-75% Glycerol 20%-60% Surfactants 0%-1% Polymeric thickener/water-soluble 0%-5%.

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Activated, Noncorrosive, Water Soluble Flux

A water-soluble flux for soldering processes is formulated as follows:

Organic acid 1%-10%

Water 5%-15%

Glycol 10%-75%

Glycerol 20%-60%

Surfactants 0%-1%

Polymeric thickener/water-soluble 0%-5%.

A specific formulation is a glacial acetic acid 3 (by weight), deionized water 10, glycerol 25, and polyethylene glycol 62.

The properties of the organic acid, aside from water solubility, should prevent charring, gumming, or obnoxious decomposition. The boiling point should permit complete removal by evaporation, prior to the end of the solder immersion cycle. Other suitable acids are: formic, propionic or other carboxylic acids.

The other materials in the flux function as a carrier and ionizing medium for the acid. They also control viscosity in the range of 50 to 150 centistokes, depending on application and solder composition. These materials also provide suitable surface tension for the wetting of the metallic and nonmetallic surfaces involved. A range of values between 35 and 60 dynes per centimeter is adequate for most purposes. The boiling point of the solvent materials is chosen to provide sufficient stability against excessive evaporation during solder immersion or contact.

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