Browse Prior Art Database

Detection of Bridges and Gaps in Interconnection Metallurgy

IP.com Disclosure Number: IPCOM000077833D
Original Publication Date: 1972-Sep-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Gangulee, A: AUTHOR [+2]

Abstract

Metal bridging in high-density integrated circuit chips and open interconnection lines (metal, polysilicon, etc.) are one of the major yield detractors.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Detection of Bridges and Gaps in Interconnection Metallurgy

Metal bridging in high-density integrated circuit chips and open interconnection lines (metal, polysilicon, etc.) are one of the major yield detractors.

The requirements for optical scanning of interconnection metallurgy are:
1) a suitable reflected light microscope with variable aperture,

multiple eyepiece and electromechanical stage drive,
2) a sensitive photometer with associated circuitry, and
3) recording and/or display equipment such as a strip-chart

recorder or storage oscilloscope.

There is scanning of preselected paths on the etched pattern and monitoring of the amount of reflected light from the probe area. The scanning path can be preselected with the use of two suitably coupled stepping motors. The probe area is determined by the magnification and aperture chosen, which also determines the signal/noise ratio. Comparison with a standard specimen is easier than an absolute measurement.

Typical idealized detection patterns are shown in Figs. 1 and 2. The whole operation can be completely automated and preprogrammed.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]