Browse Prior Art Database

Flexible Contact Probe

IP.com Disclosure Number: IPCOM000077908D
Original Publication Date: 1972-Oct-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Greene, KF: AUTHOR [+2]

Abstract

The drawing shows steps in the construction of a flexible probe with arrayed contact points. for probing conductive pads on a circuit module. Fig. 1 shows an edge view of a flexible dielectric material 3 having its surfaces clad with copper layers 4 and 5. In regions 6, where a probe contact is to be formed, the copper layer 4 and thereafter the dielectric layer 3 are etched away. Fig. 2 shows a photoresist 7 applied to the outer surface of copper layer 5, and a layer of gold 9 that is applied to the surface of copper layer 5 that is exposed by the etch operations of Fig. 1. Copper layer 4 is then removed from dielectric layer 3 and, as Fig. 3 shows, copper elements 12 are placed into regions 6 and a gold layer 14 is plated over copper elements 12.

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Flexible Contact Probe

The drawing shows steps in the construction of a flexible probe with arrayed contact points. for probing conductive pads on a circuit module. Fig. 1 shows an edge view of a flexible dielectric material 3 having its surfaces clad with copper layers 4 and 5. In regions 6, where a probe contact is to be formed, the copper layer 4 and thereafter the dielectric layer 3 are etched away. Fig. 2 shows a photoresist 7 applied to the outer surface of copper layer 5, and a layer of gold 9 that is applied to the surface of copper layer 5 that is exposed by the etch operations of Fig. 1. Copper layer 4 is then removed from dielectric layer 3 and, as Fig. 3 shows, copper elements 12 are placed into regions 6 and a gold layer 14 is plated over copper elements 12. The photoresist layer 7 is used for etching copper layer 5 to form regions 15 and the photoresist is removed. As Fig. 4 shows the completed structure, wires 16 are bonded to regions 15 for connecting a probe point to a testing circuit. The flexible contact carrier 3 is mounted on a suitable support and is placed over points to the probe on a module. The flexible probe provides good electrical contact with close spacing of the probe points, and the probe housing may provide fluid pressure for improving contact between the probe contacts and the points to be probed.

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