Browse Prior Art Database

Garnet Chip Processing for Magnetic Bubbles

IP.com Disclosure Number: IPCOM000077949D
Original Publication Date: 1972-Oct-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mendel, E: AUTHOR [+2]

Abstract

Where sectioning of a garnet wafer is required for removal of good or bad chips, unnecessary material scrapping and low yield is evident.

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Garnet Chip Processing for Magnetic Bubbles

Where sectioning of a garnet wafer is required for removal of good or bad chips, unnecessary material scrapping and low yield is evident.

If the basic garnet crystal is not cut and totally processed as a large wafer, advantages would be gained such as minimization of problems encountered in substrate polishing and problems such as flatness, parallelism and waviness would become less critical.

Initially, the basic substrate is sized to desired chip size. Epitaxial deposition of magnetic material is completed prior to initial microscopic examination in a magnetic field. Removal of chips which show defects in the material or bubble size, clears the way for fixturing good chips for mass permalloy vapor deposition and expedites the finished final product. The deposition on discrete chip size substrates allows for better discrimination of usable chips with less material waste.

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