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Connector for Multilayer Circuit Package

IP.com Disclosure Number: IPCOM000077971D
Original Publication Date: 1972-Oct-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Miller, RC: AUTHOR

Abstract

A problem relative to interconnection between a multilayered circuit package and its surrounding higher level order interconnector has always existed. To overcome this problem, and to permit the interconnection between the multilayered circuit package or module 10 and adjacent pieces of equipment to which it is to be attached, the numerous individual layers of ceramic or organic material may be extended in step fashion, such as shown at 11, and provided with longitudinally extending tab contacts 12 located on each of the steps, the steps conforming to the various layers of the module. As shown, the module may include a plurality of semiconductor chips 13 thereon, which are connected to mounting pads 14 in a conventional manner such as by soldering.

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Connector for Multilayer Circuit Package

A problem relative to interconnection between a multilayered circuit package and its surrounding higher level order interconnector has always existed. To overcome this problem, and to permit the interconnection between the multilayered circuit package or module 10 and adjacent pieces of equipment to which it is to be attached, the numerous individual layers of ceramic or organic material may be extended in step fashion, such as shown at 11, and provided with longitudinally extending tab contacts 12 located on each of the steps, the steps conforming to the various layers of the module. As shown, the module may include a plurality of semiconductor chips 13 thereon, which are connected to mounting pads 14 in a conventional manner such as by soldering.

Referring to Fig. 2, which is an enlarged fragmentary cross-sectional view of a portion of the connector 15 in conjunction with the multilayer module 10, the connector 15 contains like step portions 9 which mates with the steps 11, the connector 15 having like raised land contacts, not shown, adapted to mate with the contact tabs 12 on the steps 11 of the module 10. To provide sufficient force to effect a good contact between the tabs 12 and the mating tabs or lands on the connector 15, a clamp 16 having an upper portion 17 and lower portion 18 may be hingedly connected at 19 (see fragmentary perspective Fig. 3). By providing raised abutments 20 on the lower surface of the upper...