Browse Prior Art Database

Metallurgy for Glass Metal Modules

IP.com Disclosure Number: IPCOM000078046D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Narken, B: AUTHOR [+2]

Abstract

A four-layer metallurgy is employed in fabricating glass-metal modules. For an evaporation process, this metallurgy improves the adhesion of via studs evaporated to metal on the glass. For a plating process, it retains a metal layer which is necessary in the deposition of glass over the personality lines.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 73% of the total text.

Page 1 of 2

Metallurgy for Glass Metal Modules

A four-layer metallurgy is employed in fabricating glass-metal modules. For an evaporation process, this metallurgy improves the adhesion of via studs evaporated to metal on the glass. For a plating process, it retains a metal layer which is necessary in the deposition of glass over the personality lines.

In Fig. A. four layers 1-4 of metallurgy are evaporated on a glass substrate. The metallurgy is chromium-copper-chromium-copper. A photo-resist such as KTFR* is applied, exposed and developed. For the evaporation process, all layers are etched at 5 and 6 in Fig, B to form a personality pattern. In the plating process, chrome layer 1 in Fig. C remains on the module for use as an electroplating cathode.

In an evaporation process, copper via studs 8, 9 are evaporated on metal pads 7 in Fig. D. In Fig. F, layer 4 on top of the lines is etched away. After the vacuum deposition of the four-layer metallurgy, the parts must be removed from the vacuum chamber to have the personality pattern etched, remounted and aligned under a stud mask. The addition of layer 4 permits good adhesion of the subsequently deposited copper studs, even though layer 4 may be oxidized.

In a plating process, a photoresist material 10 such as RISTON** is laminated in Fig. C over the etched personality, exposed and developed at the location where the studs are to be plated. Via studs are electroplated at these locations. The RISTON is stripped off and chrome lay...