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Contamination Free Sputtering

IP.com Disclosure Number: IPCOM000078095D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Buchmann, A: AUTHOR [+5]

Abstract

A standard sputtering system is physically rearranged to effect process improvement, relating to cleanliness and better quality deposition of the product. The process itself can cause contamination of the surrounding area when the chamber is opened after completion of the process. This equipment is designed to eliminate that short-coming and to prevent contaminating the product before it enters the equipment. This is accomplished by isolating the chamber behind the barrier or wall so that clean room conditions are maintained where the product is handled, and the opposite side of the wall contains the vacuum chamber, pumps and electromechanical components. Thus, servicing takes place without disturbing the clean room.

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Contamination Free Sputtering

A standard sputtering system is physically rearranged to effect process improvement, relating to cleanliness and better quality deposition of the product. The process itself can cause contamination of the surrounding area when the chamber is opened after completion of the process. This equipment is designed to eliminate that short-coming and to prevent contaminating the product before it enters the equipment. This is accomplished by isolating the chamber behind the barrier or wall so that clean room conditions are maintained where the product is handled, and the opposite side of the wall contains the vacuum chamber, pumps and electromechanical components. Thus, servicing takes place without disturbing the clean room.

The product 1 enters the chamber on the circular pallet or product plate 2 by a load-unload assembly 3 which projects through the wall 4. This assembly is basically an airtight dry box 5 connecting the chamber with the clean room under controlled conditions. Bellows 6 are connected to a pressure plate 7 and are part of the lower assembly. Pressure plate 7 forms the closure for the process chamber 9 and is raised to position 8 or lowered to position 11 to open or close the chamber. Therefore, exposure of the clean room to debris from the process chamber is eliminated, and contamination of the product by the ambient atmosphere on the equipment side of the wall is eliminated. The dry box 5 is purged with a dry inert gas fro...