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Smooth Surface Aluminum Film

IP.com Disclosure Number: IPCOM000078104D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bauer, HJ: AUTHOR [+2]

Abstract

A satisfactory adhesion of the aluminum film to the substrate and a good electrical contact are ensured, by vapor depositing a thin aluminum film on a substrate at a relatively high temperature. The thickness of the think film is abt. 400 to 800 and the vapor deposition temperature abt. 400 Degrees. The remaining aluminum is subsequently vapor deposited on the alloyed thin-aluminum film at less than 200 Degrees, until the required thickness has been reached. As vapor deposition is carried out at a randomly low temperature, a film having a very smooth surface is obtained.

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Smooth Surface Aluminum Film

A satisfactory adhesion of the aluminum film to the substrate and a good electrical contact are ensured, by vapor depositing a thin aluminum film on a substrate at a relatively high temperature. The thickness of the think film is abt. 400 to 800 and the vapor deposition temperature abt. 400 Degrees. The remaining aluminum is subsequently vapor deposited on the alloyed thin- aluminum film at less than 200 Degrees, until the required thickness has been reached. As vapor deposition is carried out at a randomly low temperature, a film having a very smooth surface is obtained.

Contact sintering after vapour deposition of the aluminium film is eliminated by this method. Thus surface unevenness of the smooth vapor deposited film, due to grain growth variations during sintering, is avoided.

The method is particularly suitable for the manufacture of multilayer metallizations calling for extremely smooth surfaces, and has the additional advantage that the reflected stray light during exposure is reduced.

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