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Browse Prior Art Database

Resilient Ribbon Batch Soldering

IP.com Disclosure Number: IPCOM000078112D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Hairabedian, BZ: AUTHOR

Abstract

Batch soldering of a wide flat cable to a rigid circuit board or glass panel, where all solder connections are to be made simultaneously, requires that heat and pressure be uniformly distributed across the work.

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Resilient Ribbon Batch Soldering

Batch soldering of a wide flat cable to a rigid circuit board or glass panel, where all solder connections are to be made simultaneously, requires that heat and pressure be uniformly distributed across the work.

The device of the figure consists of a flexible metallic heating ribbon 1 backed by a resilient heat-resistant material 2. backed in turn by a rigid member 3. This assembly is brought, under pressure, in intimate contact with the flat cable 4 which is situated on panel 5. Both cable and panel have matching lands 6, one set of which is pretinned.

The resilient backing 2 insures uniform distribution of contact pressure between ribbon 1 and work 4, 5, 6, thus providing good thermal conductivity from ribbon to work.

After pressure is applied, a current pulse is applied through conductive members 7, 8 to metallic ribbon 1 to generate the heat required to flow the solder. After the joints have cooled, the upper assembly 1, 2, 3 is lifted leaving the cable 4 soldered to panel 5 through the matching lands 6.

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