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Browse Prior Art Database

Device Pad Centering Without Peripheral Dimension Restraint

IP.com Disclosure Number: IPCOM000078121D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Eide, SL: AUTHOR [+3]

Abstract

Contact pads 10 on integrated circuit chip 12 may be located very precisely for chip placement, contact for testing, or other purposes, by using the pads 10 rather than the chip sides 14 for alignment. Jaws 16 arrows 18. Jaws 16 are positioned slightly above the surface 20 of chip 12 and engage pads 10 when in the closed position, as shown. This accomplishes a very precise orientation of the chip 12 that is independent of the inherently inaccurate chip dicing operation.

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Device Pad Centering Without Peripheral Dimension Restraint

Contact pads 10 on integrated circuit chip 12 may be located very precisely for chip placement, contact for testing, or other purposes, by using the pads 10 rather than the chip sides 14 for alignment. Jaws 16 arrows 18. Jaws 16 are positioned slightly above the surface 20 of chip 12 and engage pads 10 when in the closed position, as shown. This accomplishes a very precise orientation of the chip 12 that is independent of the inherently inaccurate chip dicing operation.

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