Browse Prior Art Database

Tipped Cantilever Beam for Lead Frame Contactors

IP.com Disclosure Number: IPCOM000078170D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Perlmann, AL: AUTHOR [+2]

Abstract

Lead frame contactors with raised tips are utilized for semiconductor wafer testing. The raised tips are fabricated by etching a thin-metallic layer from both sides of a conductive sheet.

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Tipped Cantilever Beam for Lead Frame Contactors

Lead frame contactors with raised tips are utilized for semiconductor wafer testing. The raised tips are fabricated by etching a thin-metallic layer from both sides of a conductive sheet.

To form the tipped cantilever beams, etching of sheet 1 is performed in steps from sides A and B. Sheet 1 is formed of a material that is both etchable and conductive. Masks 2 and 3 are employed for the first and second exposures which are performed, respectively, on sides A and B. In the first etching step, the shaded portion of mask 2 is the portion removed on sheet 1. Typically, as shown at 4, this etching will go through half of the material thickness as at 5. For the second exposure, mask 3 is employed which removes the portion 6 from block 7 as well as the portion 5A. The tipped configuration that remains is indicated at 8.

In both etching steps, the depth of the etching determines the final configuration of the beam. In carrying out the etching, the alignment between masks 2 and 3 is critical in determining the proper configuration for the beam. This configuration of the tip is controlled by the size and shape of the shaded area on the masks 2 and 3.

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