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Browse Prior Art Database

Semiconductor Wafer Backside Protection

IP.com Disclosure Number: IPCOM000078173D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hoeg, AJ: AUTHOR [+2]

Abstract

Conventionally, backside protective coating is applied to semiconductor wafers, wherever required, by spin application of photoresist. However, since such operation normally involves contact support of the front surface of the wafer during the operation, defects such as scratching, resists splatter, and resist pickup are difficult to eliminate, with consequent reduction in processing yields.

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Semiconductor Wafer Backside Protection

Conventionally, backside protective coating is applied to semiconductor wafers, wherever required, by spin application of photoresist. However, since such operation normally involves contact support of the front surface of the wafer during the operation, defects such as scratching, resists splatter, and resist pickup are difficult to eliminate, with consequent reduction in processing yields.

It has now been found that such disadvantages can be substantially reduced by placing the backside of the wafer on a dry resist film, such as RISTON*, prior to conventional resist-prebake operations. * Trademark of E. I. du Pont de Nemours & Co.

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