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Capsule Cooling Following Diffusion

IP.com Disclosure Number: IPCOM000078175D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Edel, W: AUTHOR [+3]

Abstract

In this automated quenching operation, quartz capsules containing semiconductor wafers are cooled at a uniform rate which minimizes deformation and stress to the wafers.

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Capsule Cooling Following Diffusion

In this automated quenching operation, quartz capsules containing semiconductor wafers are cooled at a uniform rate which minimizes deformation and stress to the wafers.

In this operation, a quartz capsule 10 containing wafers 20 is quenched upon removal from furnace 22 under a spray station 24. In the quenching operation, the cooling rate and the area of cooling, are process variables. The operation is a continuous process, starting from the heated furnace until the product is exposed to ambient conditions. In the standard capsule containing approximately thirty 2-1/4" wafers, the flow rate of water flowing from nozzles 26 is 0.5 gallon per minute for five minutes. When the temperature of the capsule is reduced to 350 degrees C or less, the cooling flow rate is increased to two gallons per minute for an initial five minutes. At the end of this time, the temperature of the capsule and the wafers within has been reduced to essentially ambient temperatures.

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