Browse Prior Art Database

Solder Ring Applicator

IP.com Disclosure Number: IPCOM000078199D
Original Publication Date: 1972-Nov-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 3 page(s) / 45K

Publishing Venue

IBM

Related People

Pierson, SW: AUTHOR

Abstract

Solder rings can be applied to circuit card pins or holes with a simply programmed reciprocating punch mechanism.

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Solder Ring Applicator

Solder rings can be applied to circuit card pins or holes with a simply programmed reciprocating punch mechanism.

The mechanism of Fig. 1 is constructed to apply solder rings to pins 1 of card
2. Ring punch 3 and slide 4, to which it is affixed, move vertically between support plates 5 and 6, being driven down by reciprocating template assembly 7 and returned by springs 8. A needle punch 9 is frictionally supported in hole 10 and inside ring punch 3, by spring loaded brakes 11. Needle punch 9 extends downward towards solder supply strip 12, passing between supply and take up reels 13 and 14. Needle punch 9 extends upward to bifurcated strike plate 15 secured to plate 6. The punch head 16 is limited in its travel by two arms 17 of the strike plate.

At initial operation, needle punch 9 extends below the end of ring punch 3. As template assembly 7 moves down, it forces slide 4 and ring punch 3 down. With the needle punch 9 frictionally attached to slide 4 by brakes 11, it will also move and pierce a hole in solder strip 13. As slide 4 is further forced down, needle punch 9 is stopped by the lower limit of plate 15 which overrides brakes
11. The ring punch 3 then continues down and cuts the pierced solder ring from the supply strip and forces the ring over pin 1.

When template assembly 7 moves up, springs 8 return the slide and punches toward their retracted positions. However, brakes 11 on the needle punch are again overridden and the needle punch 9 is restrained relative to the upward moving slide, by the upper limit of strike plate 15. This leaves the needle punch 9 extending below the end of the ring punch 3.

The mechanism in Fi...