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Chip Joining Technique Applied to a Multilayer Circuit Module

IP.com Disclosure Number: IPCOM000078223D
Original Publication Date: 1972-Dec-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Nicolas, J: AUTHOR

Abstract

The semiconductor chip joining technique, as described in US Patent No. 3 458 925 assigned to IBM Corporation, which details convenient means to attach a semiconductor chip or die onto the insulating ceramic module surface, is now well-known in the semiconductor art. This technique is suggested to be applied to the attachment of Multilayer Circuit (MLC) modules onto sockets or cards considered as supporting materials.

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Chip Joining Technique Applied to a Multilayer Circuit Module

The semiconductor chip joining technique, as described in US Patent No. 3 458 925 assigned to IBM Corporation, which details convenient means to attach a semiconductor chip or die onto the insulating ceramic module surface, is now well-known in the semiconductor art. This technique is suggested to be applied to the attachment of Multilayer Circuit (MLC) modules onto sockets or cards considered as supporting materials.

A conventional way of attaching multilayer circuit modules to their supporting materials is represented in Fig. 1. Nail shaped pins 11 are bonded to the back of modules 12 at desired recesses through deposited Pb-Sn solder 13. The internal feedthrough conductors and internal voltage or ground planes have not been shown. This technique often exhibits drawbacks such as: bad adherence of pins to the supporting material, low resistance to a breaking effort and no flexibility in the use of such completed modules.

The new process (Fig. 2) is characterized in that the packaging is effected in a two step process:

1) Multilayer circuit module 21 is provided without any pins, but with solder filling recesses 22 where electrical contacts must be made,

2) An intermediate socket 23 is provided with swaged pins 24, the heads of which have been previously tinned.

Using a conventional thermal heating step, the solder reflow which occurs firmly attaches the MLC module to the socket.

As an alternative, the...