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Preventing Hillock Growth in Pb Superconducting Multilayer Devices

IP.com Disclosure Number: IPCOM000078268D
Original Publication Date: 1972-Dec-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gangulee, A: AUTHOR

Abstract

The use of plastic substrates, the coefficients of thermal expansions of which match that of Pb, is suggested in order to prevent hillock growth in Pb superconducting multilayer devices.

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Preventing Hillock Growth in Pb Superconducting Multilayer Devices

The use of plastic substrates, the coefficients of thermal expansions of which match that of Pb, is suggested in order to prevent hillock growth in Pb superconducting multilayer devices.

The following five plastics have coefficients of thermal expansion matching that of Pb: 1) Polyphenylene oxide

2) Polypropylene with any filler

3) Melamine formaldehyde with fabric filler

4) Phenol formaldehyde with mica filler

5) Phenol furfurol with mica filler Of these plastics,
(1), (2) and (3) are thermoplastic and plastics (4) and (5) are thermosetting. Plastic (1) is particularly recommended because of its excellent low-temperature mechanical properties.

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