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Anode for Use in Electroplating Processes

IP.com Disclosure Number: IPCOM000078313D
Original Publication Date: 1972-Dec-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Horstmann, RE: AUTHOR [+3]

Abstract

Electroplating apparatus presently used for fabricating nickel-iron, copper, and gold microstructures requires that a cathode be located at the bottom of the tank and the anode at the top. This keeps the cathode (area being plated) free from gas bubble interference. However, gas bubbles collect at the top electrode (anode) and can form a barrier between the anode and cathode, which will interfere with the electroplating area.

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Anode for Use in Electroplating Processes

Electroplating apparatus presently used for fabricating nickel-iron, copper, and gold microstructures requires that a cathode be located at the bottom of the tank and the anode at the top. This keeps the cathode (area being plated) free from gas bubble interference. However, gas bubbles collect at the top electrode (anode) and can form a barrier between the anode and cathode, which will interfere with the electroplating area.

The anode structure shown is a corrugated anode having punched-through openings in various locations, which allow venting of gas. This anode is particularly easy to fabricate and uses only a small amount of anode material as opposed to anodes having holes in them.

The anode is easily made by punching flapped openings through the platinum anode material. After the punching operation, the anode is folded to provide a corrugated structure.

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