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Refillable Liquid Cooled Module

IP.com Disclosure Number: IPCOM000078382D
Original Publication Date: 1972-Dec-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR

Abstract

Electronic components can be packaged in hermetically sealed modules, which contain coolant fluid to dissipate the heat of the components. However, the liquids commonly used for cooling are quite volatile and fugitive, and any leaks in the package will cause fluid loss, which is not tolerable for component performance. In addition. the casings for such packages can be expensive, and their replacement is not desirable if leaks occur:

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Refillable Liquid Cooled Module

Electronic components can be packaged in hermetically sealed modules, which contain coolant fluid to dissipate the heat of the components. However, the liquids commonly used for cooling are quite volatile and fugitive, and any leaks in the package will cause fluid loss, which is not tolerable for component performance. In addition. the casings for such packages can be expensive, and their replacement is not desirable if leaks occur:

To permit replenishment of the fluid, the casing contains a valve which permits refilling of fluid -- during actual usage if necessary -- by a pressurized fluid container. The valves must be hermetic and strong. Such valves are known, and commonly use a ball pressed against a gasket, or a tapered valve pressed against a similar mating surface, or other appropriate configuration. To avoid contamination of the liquid coolant, the valve should be made of noncontaminating material such as metal. Additional safety against leakage can be provided if the ball or gasket housing is fabricated with a coating of soft metal, such as indium to provide a positive seal. Short-chain polymers or other materials which can be dissolved in the fluid should be avoided.

To further insure the hermeticity of the seal as shown in Fig. 1, a screw 4 and 0-ring 5 can be used to seal the chamber above the valve. To further insure the hermeticity of the structure, the bond of the casing to the electronic module 7, as shown in Fig. 2...