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Rosin Flux Solvent

IP.com Disclosure Number: IPCOM000078428D
Original Publication Date: 1973-Jan-01
Included in the Prior Art Database: 2005-Feb-25
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, TJ: AUTHOR [+3]

Abstract

Residue from rosin flux used with high lead, reflowed solders has been difficult to remove from the solder joints and ceramic substrates. Its removal can be accomplished readily, however, by immersion in methylene chloride/methanol to which has been added an anionic phosphate ester surfactant in an amount of 1; by volume. In this case, P-61 surfactant, a product of Ritter Corporation of Amsterdam, New York, was used.

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Rosin Flux Solvent

Residue from rosin flux used with high lead, reflowed solders has been difficult to remove from the solder joints and ceramic substrates. Its removal can be accomplished readily, however, by immersion in methylene chloride/methanol to which has been added an anionic phosphate ester surfactant in an amount of 1; by volume. In this case, P-61 surfactant, a product of Ritter Corporation of Amsterdam, New York, was used.

With ceramic substrates, immersion was maintained for approximately five minutes. The substrates were then subjected to a high-pressure spray spray of deionized water at 110 degrees F for 30-60 seconds, and dried.

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