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Browse Prior Art Database

Semiconductor Wafer Placement

IP.com Disclosure Number: IPCOM000078530D
Original Publication Date: 1973-Jan-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Hansen, HE: AUTHOR [+2]

Abstract

The accurate placement of semiconductor wafers on a rotating hot plate has been difficult, due to wafer float when depositing the wafer. Referring to the drawing, a directional Bernoulli head 10 having a depending pad 11 which projects below the lower surface 10A of the head, is illustrated as being connected to an inert gas supply line 12, in the present instance containing nitrogen. The inert gas feed line 13 supplies through a regulator 14, a flow control valve 15 in the high-flow trunk which feeds the line 12. A solenoid control valve 16 operates to supply the inert gas to the line 12. The low-flow side of the trunk includes a low-pressure flow regulator 17 which connects to a second low-flow solenoid actuator valve 18, for providing a low volumetric flow of inert gas to the inert gas supply line 12.

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Semiconductor Wafer Placement

The accurate placement of semiconductor wafers on a rotating hot plate has been difficult, due to wafer float when depositing the wafer. Referring to the drawing, a directional Bernoulli head 10 having a depending pad 11 which projects below the lower surface 10A of the head, is illustrated as being connected to an inert gas supply line 12, in the present instance containing nitrogen. The inert gas feed line 13 supplies through a regulator 14, a flow control valve 15 in the high-flow trunk which feeds the line 12. A solenoid control valve 16 operates to supply the inert gas to the line 12. The low-flow side of the trunk includes a low-pressure flow regulator 17 which connects to a second low- flow solenoid actuator valve 18, for providing a low volumetric flow of inert gas to the inert gas supply line 12. A feed filter 19 is placed in the circuit for purging the gas prior to its being applied to the head 10.

The head 10 is connected by means, not shown, to permit it to traverse the hot plate to a wafer pickup point and return, the traversing action being determined by conventional means such as photodetection and limit switches. When the pickup position is reached, the high-flow solenoid valve 16 is opened to permit the pickup of a semiconductor wafer. The head is then moved to a position superimposed of the hot plate 20 and the low-flow solenoid valve 18 is opened, after which the high-flow solenoid valve 16 is closed. This action p...