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Multilayer Electronic Package Stud Repopulation

IP.com Disclosure Number: IPCOM000078535D
Original Publication Date: 1973-Jan-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hoffman, HS: AUTHOR [+4]

Abstract

Repair and replacement of studs or vertical conductive path interconnections through the dielectric body are accomplished, by firstly forming copper stud preforms by evaporation through molybdenum or similar masks onto a glass or glass coated substrate. Stud preforms are positioned at missing stud sites. Bypassing an appropriate voltage between the stud top and the connecting land or pin thereby bonds the stud in place, preventing possible subsequent misalignment during glassing operations.

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Multilayer Electronic Package Stud Repopulation

Repair and replacement of studs or vertical conductive path interconnections through the dielectric body are accomplished, by firstly forming copper stud preforms by evaporation through molybdenum or similar masks onto a glass or glass coated substrate. Stud preforms are positioned at missing stud sites. Bypassing an appropriate voltage between the stud top and the connecting land or pin thereby bonds the stud in place, preventing possible subsequent misalignment during glassing operations.

A subsequent glassing heat cycle of approximately 800 degrees C provides adequate temperature conditions for diffusion of the stud to land metallurgy, to insure proper interface conductance.

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