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Applying Conductive Patterns on Substrates

IP.com Disclosure Number: IPCOM000078564D
Original Publication Date: 1973-Jan-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Cole, JN: AUTHOR [+2]

Abstract

A method of applying conductive patterns on substrates may be achieved by employing pressurized molten metal which is released in droplet form, charged and thereafter pattern controlled by use of a deflection mechanism.

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Applying Conductive Patterns on Substrates

A method of applying conductive patterns on substrates may be achieved by employing pressurized molten metal which is released in droplet form, charged and thereafter pattern controlled by use of a deflection mechanism.

The mechanism to carry out the desired steps is schematically illustrated above, wherein a pressurized container 10 of desired metal in its molten state having a nozzle 12 is shown. The metal is forced out of the orifice 12 in droplet form and passes through a set of charging plates. The charged droplets are then passed through a pair of deflection plates, which control the position of impact on a surface of a substrate target. The total apparatus is operated in an inert atmosphere to prevent oxidation of the metal, with the temperature of the atmosphere and substrate held slightly below that of the molten metal. The spacing between the nozzle and substrate should be closely controlled in relation to temperature and droplet velocity.

Conventional electronic controls are utilized to operate the deflection system.

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