Browse Prior Art Database

Water Soluble Cored Solder

IP.com Disclosure Number: IPCOM000078594D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Girard, JP: AUTHOR [+3]

Abstract

This is a water soluble flux cored solder comprising an extruded solder alloy rod 10, having a core 11 of liquid organic chemicals, viscous liquid, or powdered chemicals. The core 11 may be preferably one of the three following compositions: By Volume 1) Mannitol or sorbitol 10 to 30% Distilled water (H(2)O) 90 to 70% 2) Glycerine 70 to 90% Maleic acid 1 to 2% Triethanolamine 9 to 8% 3) Glycerine 80 to 90% Alcohol (methanol) 10 to 20% Fluorocarbon 0.1 to 0.3%.

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Water Soluble Cored Solder

This is a water soluble flux cored solder comprising an extruded solder alloy rod 10, having a core 11 of liquid organic chemicals, viscous liquid, or powdered chemicals. The core 11 may be preferably one of the three following compositions: By Volume
1) Mannitol or sorbitol 10 to 30%

Distilled water (H(2)O) 90 to 70%
2) Glycerine 70 to 90%

Maleic acid 1 to 2%

Triethanolamine 9 to 8%
3) Glycerine 80 to 90%

Alcohol (methanol) 10 to 20%

Fluorocarbon 0.1 to 0.3%.

The core compositions are characterized as cleanable by use of water and meet the antiair and antipollution criteria.

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