Browse Prior Art Database

Contact Method for Thin Supraconductive Wires

IP.com Disclosure Number: IPCOM000078641D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Walter, W: AUTHOR

Abstract

In transistor technology, very thin wires, e.g. Au, Al, etc., are used for contacts to the connections by thermocompression or similar methods. The wires are wound from a spool and passed through a glass nozzle. For contacting supraconductive elements, supraconducting wires are necessary (phi 20-50 mu). Suitable materials are lead, tin, indium, etc., or their alloys. These low-melting point materials are soft and wires have the disadvantage of sticking on contact with one another, so that they can not be wound onto a spool and stocked.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Contact Method for Thin Supraconductive Wires

In transistor technology, very thin wires, e.g. Au, Al, etc., are used for contacts to the connections by thermocompression or similar methods. The wires are wound from a spool and passed through a glass nozzle. For contacting supraconductive elements, supraconducting wires are necessary (phi 20-50 mu). Suitable materials are lead, tin, indium, etc., or their alloys. These low-melting point materials are soft and wires have the disadvantage of sticking on contact with one another, so that they can not be wound onto a spool and stocked.

This device produces supraconducting wires in the desired length immediately before use.

The material filled into the nozzle, e.g. indium, is heated up to approx. 120 degrees C. By means of a pneumatic piston, a wire is extruded through the fine nozzle (020 mu) to the desired length. The wire is pressure connected to the circuit.

The device obviates threading a thin wire through a fine glass nozzle, breaking the wire and blocking the nozzle. It facilitates use of various wire diameters by easy exchange of the nozzle.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]