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Selective Metallization of Ceramic Substrates

IP.com Disclosure Number: IPCOM000078669D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kaus, G: AUTHOR [+2]

Abstract

The conductors to be applied to a green-ceramic substrate are generated by metalliferous thermoplastic powder sprayed onto the substrate, and are selectively exposed to a laser beam to bond them to the substrate. The energy of the laser beam is chosen so that the green-ceramic material is not damaged.

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Selective Metallization of Ceramic Substrates

The conductors to be applied to a green-ceramic substrate are generated by metalliferous thermoplastic powder sprayed onto the substrate, and are selectively exposed to a laser beam to bond them to the substrate. The energy of the laser beam is chosen so that the green-ceramic material is not damaged.

An abt. 30 - 50 mu m thick layer of fine-grained powder is sprayed onto the substrate. The mean grain diameter of the two-phase powder, having an appropriate thermoplastic/metal ratio, is abt. 10 mu m.

The prepared substrate is accurately adjusted on an object carrier and is subsequently briefly exposed to an electronically controlled laser beam. The powder is heated in the radiated areas, whereby the thermoplastic phase melts, embedding the metal particles, and adheres to the substrate. By selecting a laser of suitable wavelength, the radiation energy is absorbed by the powder only but not by the coated substrate, so that the green-ceramic material remains undamaged. The relatively low-laser energy does not affect the metallic phase of the powder.

The nonexposed powder which does not adhere to the substrate is subsequently removed from the substrate surface, by compressed air or other suitable means. As the ceramic substrate is fired, the remaining thermoplastic material volatilizes, while the metal particles contained in the powder sinter together, so forming continuous conductors which have good adhesion to the substr...