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Continuous Processing for Substrate Manufacture

IP.com Disclosure Number: IPCOM000078675D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Iafrate, PF: AUTHOR [+2]

Abstract

This process permits substrates to be produced in a continuous manner, thus significantly increasing the rate of production. The completed substrate as shown in the figure is used to mount integrated circuits thereon.

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Continuous Processing for Substrate Manufacture

This process permits substrates to be produced in a continuous manner, thus significantly increasing the rate of production. The completed substrate as shown in the figure is used to mount integrated circuits thereon.

On at least one surface of a sheet of flexible insulator material, such as a polyimide plastic film which is commercially available in large rolls, a conductive material, such as copper, is laminated. Conductive patterns are printed on the copper in a continuous high-speed process using rotogravure printing techniques. This is done by depositing an etch resistant ink pattern upon the copper surface. After printing, the excess copper is etched away and conductive patterns remain.

The flexible material incorporating the conductive pattern arrays is then cut into pieces 10. Individual rigid members 12, usually made of a special type of ceramics capable of withstanding a certain amount of mechanical force, are mounted and secured to flexible sheets 10 by conductive members, such as contact pins 14 which simultaneously establish an electrical connection to pattern arrays 16. Optionally, once rigid substrate 12 has been mounted to flexible sheets 10, the area of the pattern is subjected to a solder bath, in which the electrical connection between pattern 16 on the flexible material and each pin 14 is ensured further. If patterns exist on both sides of the flexible material, it is preferable to leave a small...