Browse Prior Art Database

Substrate Carrier for Continuous Vapor Deposition Process

IP.com Disclosure Number: IPCOM000078683D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Hoben, RJ: AUTHOR

Abstract

When carrying out continuous vapor-deposition processes such as described by Foehring et al in U. S. Patent 3,672,948, carriers each holding a semiconductor wafer are continuously fed through a chemical vapor-deposition process tube. Problems are sometimes encountered with the carriers jamming in the tube.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Substrate Carrier for Continuous Vapor Deposition Process

When carrying out continuous vapor-deposition processes such as described by Foehring et al in U. S. Patent 3,672,948, carriers each holding a semiconductor wafer are continuously fed through a chemical vapor-deposition process tube. Problems are sometimes encountered with the carriers jamming in the tube.

The carriers 10 shown eliminate such problems, by providing a tongue 12 at one end of the carrier and a groove 14 at the other end of the carrier, into which the tongue of another carrier may fit to maintain the carriers 10 in line. Each carrier 10 holds a single semiconductor wafer 16 in a conventional manner, for passage through a chemical vapor-deposition process tube. It has been determined, that the tongue and groove structure for such carriers allows a coefficient of friction of twice as much as can be tolerated with a given carrier geometry, without the tongue and groove structure, before jamming will occur.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]