Browse Prior Art Database

Semiwafer Package

IP.com Disclosure Number: IPCOM000078686D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Aimi, BR: AUTHOR

Abstract

This integrated circuit package provides a self-sufficient, fully functional memory block and eliminates interconnections between semiconductor wafer and pluggable terminals. A semiconductor wafer containing, for example a memory circuit, is designed with two fully functional halves having input/output (I/O) pads along a diameter of the wafer. After the wafer has been cut along its diameter, a semiwafer 1 is mounted directly into terminal strip 2. Either a single half wafer, as shown, or two halves mounted back-to-back may be used.

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Semiwafer Package

This integrated circuit package provides a self-sufficient, fully functional memory block and eliminates interconnections between semiconductor wafer and pluggable terminals. A semiconductor wafer containing, for example a memory circuit, is designed with two fully functional halves having input/output (I/O) pads along a diameter of the wafer. After the wafer has been cut along its diameter, a semiwafer 1 is mounted directly into terminal strip 2. Either a single half wafer, as shown, or two halves mounted back-to-back may be used.

I/O terminal pins 3 are positioned along the diameter of semiwafer 1, at a pitch determined by the number of pins required. A metal or ceramic clamshell- like heat sink 4 is clamped to the wafer and terminal strip. Silicone grease or other thermally conductive material may be used between the semiwafer 1 and heat sink 4 to increase thermal conductivity, and to allow relative movement between the semiwafer and the heat sink due to any mismatch in thermal expansion coefficients.

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