Browse Prior Art Database

Reusable Carrier Plate for Transfer Circuitry Molding

IP.com Disclosure Number: IPCOM000078710D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Gregor, LV: AUTHOR [+3]

Abstract

In the process, a suitable stainless steel carrier plate 70 is covered with a silicon nitride masking layer 72. The layer 72 is deposited either by sputter etching or in situ reverse contact. Masking provides the desired masking pattern for the module. The silicon nitride masking layer 72 is extremely hard and resistant to cracks, and thus provides a long life reusable plating mask for the process.

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Reusable Carrier Plate for Transfer Circuitry Molding

In the process, a suitable stainless steel carrier plate 70 is covered with a silicon nitride masking layer 72. The layer 72 is deposited either by sputter etching or in situ reverse contact. Masking provides the desired masking pattern for the module. The silicon nitride masking layer 72 is extremely hard and resistant to cracks, and thus provides a long life reusable plating mask for the process.

A plurality of openings 74 and 76 are formed in carrier plate 70 and conform to the desired input/output pin configuration. A suitable plating operation forms the metallized interconnection pattern 80., Thereafter, a semiconductor chip 82 is joined by a plurality of solder interconnections, schematically depicted at 84 and
86. Next, a molding operation is used to form plastic body 90. Finally, the carrier plate 70 is separated away from the molded substrate 90, so as to form a plastic encapsulated integrated circuit module package, a portion of which is shown in the last figure.

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