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Fabricating Insulated Metal Composites for Electronic Packages

IP.com Disclosure Number: IPCOM000078713D
Original Publication Date: 1973-Feb-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Leung, GB: AUTHOR

Abstract

This package improves power dissipation by increasing thermal transmission characteristics, by employing a metal core substrate coated with an insulating material. The metal core provides excellent electrical characteristics as a ground plane. Moreover, this arrangement offers dimensional flexibility and thus permits multiple module processing capability.

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Fabricating Insulated Metal Composites for Electronic Packages

This package improves power dissipation by increasing thermal transmission characteristics, by employing a metal core substrate coated with an insulating material. The metal core provides excellent electrical characteristics as a ground plane. Moreover, this arrangement offers dimensional flexibility and thus permits multiple module processing capability.

A relatively large thin stable base metal plate 10 serves as a substrate core. A plurality of holes 12 are formed through the core to accommodate interconnecting pins inserted at a later state in the process, not shown. Also, a plurality of slots 14 defining individual package sizes are cut or scored into the base 10. The selection of the metal core material is dependent upon the desired functional characteristics, and comprise material such as ferrous and refractory metals having high-thermal conductivity rates.

The metal plate 10 is then coated with an insulating material. Suitable metallization and personalization techniques, such as screen printing or vacuum deposition are then performed in order to deposit the desired metallic interconnecting pattern, not shown. The individual sections defined by the slots 14, i.e. fugitive sections, are then severed e.g. section 16. The batch processing can be carried through pinning and tinning, and possibly right to the chip attachment operation before severing. Exposed metal edges can be protected by encapsu...