Browse Prior Art Database

Improving Etching Capabilities

IP.com Disclosure Number: IPCOM000078753D
Original Publication Date: 1973-Mar-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Heilemann, AH: AUTHOR

Abstract

A method and apparatus for the spray etching of miniature holes in the order of 0.004" in thin articles (0.004" in thickness) with a tolerance in the order of +/- 0.002" is provided.

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Improving Etching Capabilities

A method and apparatus for the spray etching of miniature holes in the order of 0.004" in thin articles (0.004" in thickness) with a tolerance in the order of +/- 0.002" is provided.

The apparatus may most advantageously be used to produce thin metal masks which are to be subsequently used for masking of micro-miniature semiconductor devices, during the sputter etching of such devices.

One standard practice for uniformly etching such holes involves rotating the article in a vertical plane past a pair of spray nozzles (designated nozzle 1 and nozzle 2 in Fig. A); these nozzles apply a spray etch perpendicular to the rotating article. However, this technique has failed to give uniform etching within the above-mentioned tolerances. It has been found that this nonuniformity is primarily due to the fact, that points on the article closer to the center of rotation have slower lateral velocities than points farther from the center of rotation. Therefore, if a pair of sprays, such as that from nozzle 1 and nozzle 2 which give substantial uniform distribution over the article, is used alone, regions closer to the center of rotation will be under the spray for a greater residence time than more distant regions and, thus, will receive more etchant. In order to offset this effect, the present apparatus provides a third adjustable nozzle, which can be empirically adjusted so as to provide additional compensatory spray for the regions of the arti...