Browse Prior Art Database

Interconnection Alignment Multichip Module

IP.com Disclosure Number: IPCOM000078763D
Original Publication Date: 1973-Mar-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Balderes, D: AUTHOR [+2]

Abstract

An approach is provided for positioning solder reflow joint integrated circuit chips on a circuit card. Initially, the chips 10 are positioned on metallization fingers 11 which are affixed to decal 12 which, in turn. is attached to glass fixture 13. The glass fixture and chips are then lowered into position on the card 14, which may be a multilevel ceramic card, as shown. The card contains surface lands 15 to which metallization fingers 11 are to be attached.

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Interconnection Alignment Multichip Module

An approach is provided for positioning solder reflow joint integrated circuit chips on a circuit card. Initially, the chips 10 are positioned on metallization fingers 11 which are affixed to decal 12 which, in turn. is attached to glass fixture
13. The glass fixture and chips are then lowered into position on the card 14, which may be a multilevel ceramic card, as shown. The card contains surface lands 15 to which metallization fingers 11 are to be attached.

Once the glass fixture is positioned with respect to the card, the assembly is heated to form a connection between metallization fingers 11 and lands 15. Then, the glass fixture is separated from the assembly, e.g., by dissolving the decal to leave the chips affixed and mounted in their desired positions on the card 14.

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