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Extrusion Printing

IP.com Disclosure Number: IPCOM000078767D
Original Publication Date: 1973-Mar-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Delio, R: AUTHOR

Abstract

Many times it is necessary and desirable to deposit conductive lands or wiring directly onto a substrate without recourse to conventional duplicating techniques, for example, masks, printing plates, photolithography, etc. As is well known, the manufacture of electronic components in packages requires fabrication of conductor patterns or circuits on suitable substrates, for the purpose of interconnecting the terminals of circuit elements or components. Conventionally, the fabrication of the conductive patterns has been accomplished by either discrete wiring between the terminals, or a replication technique utilizing a replica of the desired conductor pattern such as a mask, etc. This latter technique is costly when only a few parts are required, while the former method (i.e.

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Extrusion Printing

Many times it is necessary and desirable to deposit conductive lands or wiring directly onto a substrate without recourse to conventional duplicating techniques, for example, masks, printing plates, photolithography, etc. As is well known, the manufacture of electronic components in packages requires fabrication of conductor patterns or circuits on suitable substrates, for the purpose of interconnecting the terminals of circuit elements or components. Conventionally, the fabrication of the conductive patterns has been accomplished by either discrete wiring between the terminals, or a replication technique utilizing a replica of the desired conductor pattern such as a mask, etc. This latter technique is costly when only a few parts are required, while the former method
(i.e. discrete metallic wires) is incapable of the miniaturization required. Described and shown is an automated generation and conductive pattern routing apparatus and method. Fig. 1, a substrate 10 is shown mounted on a table or the like 11, to which is applied, as by a nozzle block 12, a conductive land 13. Either the nozzle may be moved to provide the land or the table 11 may be provided with suitable X-Y motion devices. The nozzle block 12 includes an entry port 13A for the application of paste under pressure to the nozzle block, and a valve 14 to permit, by a simple up and down motion, the starting and stopping of conductive paste flow.

In Fig. 2 is illustrated a nozzle bloc...