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Solder Fatigue Tester

IP.com Disclosure Number: IPCOM000078855D
Original Publication Date: 1973-Mar-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Wild, RN: AUTHOR

Abstract

This tester is capable of applying strain displacements from as little as 0.000050 inch up to 0.020 inch at very low-stress rates, with test speeds varying from 40 minutes per cycle to 200 cycles per minute.

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Solder Fatigue Tester

This tester is capable of applying strain displacements from as little as
0.000050 inch up to 0.020 inch at very low-stress rates, with test speeds varying from 40 minutes per cycle to 200 cycles per minute.

Tester 1 comprises a beam 2 pivotally connected at one end to rigid support 3 and at its opposite end connected by link 4 to eccentric adjustable cam 5. Adjacent its one end beam 2 is pivotally connected by pin 6 to plate 7, to the under side of which are rigidly secured the upper ones of pairs of gripper elements 8. The lower ones of each pair of gripper elements 8 project upwardly from and are firmly secured to rigid plate 9, mounted on stationary reinforced table 10.

Solder-joined specimens 11 to be tested are clamped adjacent their upper and lower end;, within aligned pairs of upper and lower gripping elements 8. Cam 5 is rotated for causing a vertical displacement of beam 2 relative to table
10. During this movement, strain is maintained constant at a preselected magnitude, despite load variations and the pivotal-type support of beam 2 and plate 7, by subjecting the plate to the forces of four pairs of rectangularly spaced opposing helical springs (only two pairs 12, 13 of which are shown). Beam 2 preferably has a 5:1 ratio so that for each unit of vertical displacement of beam 2 by cam 5, the plate 7 and hence upper portions of specimens 11 will be subjected to only one-fifth such unit of vertical displacement; and the helical spri...