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Water Soluble Solder Fluxes

IP.com Disclosure Number: IPCOM000078930D
Original Publication Date: 1973-Apr-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Peters, HG: AUTHOR [+2]

Abstract

Water soluble solder fluxes that have small quantities of low-boiling point solvents, provide greater stability for high-temperature solders and are also suitable for hand soldering operations. Examples of such fluxes with proportions by weight are given below; the first formulation is a flux suitable for wave-solder machines and hand soldering: Dimethylamine hydrochloride 5.7% Oxalic acid 8.5% Butyl CELLOSOLVE* (liquid glycol ether) 85.8% .

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Water Soluble Solder Fluxes

Water soluble solder fluxes that have small quantities of low-boiling point solvents, provide greater stability for high-temperature solders and are also suitable for hand soldering operations. Examples of such fluxes with proportions by weight are given below; the first formulation is a flux suitable for wave-solder machines and hand soldering: Dimethylamine hydrochloride 5.7% Oxalic acid
8.5% Butyl CELLOSOLVE* (liquid glycol ether) 85.8% .

A second formulation has been found preferable for hand soldering, and reduces the number of pin holes or blow holes usually experienced with rapidly evaporating solvents: Tartaric acid 5.00% Dimethylamine hydrochloride 3.75% Butyl CELLOSOLVE* (liquid glycol ether) 50.00% Polyethylene glycol 400
41.25%

Oxalic acid can be readily and effectively substituted for the tartaric acid. * Trademark of Union Carbide Corporation.

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