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Elastomer to Polyamide Bonding Process

IP.com Disclosure Number: IPCOM000078964D
Original Publication Date: 1973-Apr-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Acitelli, MA: AUTHOR [+2]

Abstract

This bonding process provides an inexpensive, controlled thickness, structural bond between an elastomer, such as rubber, and a polyamide, such as nylon.

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Elastomer to Polyamide Bonding Process

This bonding process provides an inexpensive, controlled thickness, structural bond between an elastomer, such as rubber, and a polyamide, such as nylon.

During the molding of the rubber part, the part is also laminated to a 0.005 inch thick film of heat stabilized polyamide using an adhesive such as CHEMLOK 205*. An example of this kind of film would be CAPRAN**, a heat stabilized nylon-6 film. The heat stabilized film is capable of withstanding the molding temperatures and pressures, whereas a molded part such as the nylon carrier would not.

After the rubber has been laminated to the film, the film can then be solvent or ultrasonically bonded to the nylon part. A typical solvent might be an 88- percent solution of phenol in water.

This bonding method has the following advantages: The bond thickness can be held within close tolerances; the bonding fixtures, etc., require a minimum of clean up; the finished part does not require any secondary operations such as the removal of excessive adhesive, etc.; the need for expensive fixtures and adhesive application equipment, normally required for precision bonding, is eliminated; and, the cost of the finished part is at a minimum.

The process described above may also work with other thermally stable thermoplastic films, which lend themselves to solvent or ultrasonic bonding to their bulk form. * Trademark of Hughson Chemical Company, division of Lord Corporation. ** Trademark of Al...