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Reduction of Saw Damage in Silicon Wafer High Speed Slicing

IP.com Disclosure Number: IPCOM000079033D
Original Publication Date: 1973-Apr-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Schwuttke, GH: AUTHOR

Abstract

Saw damage (microcracks) in silicon wafers during high-speed slicing is reduced, by minimizing the resolved shear forces in the [111] glide planes.

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Reduction of Saw Damage in Silicon Wafer High Speed Slicing

Saw damage (microcracks) in silicon wafers during high-speed slicing is reduced, by minimizing the resolved shear forces in the [111] glide planes.

Mounting the silicon crystal for slicing (standard way), as indicated in Fig. 1, puts the active forces during slicing (blade force F(1) and push rod force F(2)) into the [111] planes, consequently, the shear forces are maximum.

The shear forces are minimized by rotating the crystal, as indicated in Fig. 2, or by tilting the crystal three to fifteen degrees out of the [001] plane, as indicated in Fig. 3.

Accordingly, the resolved shear forces are minimized and crystal slices contain saw damage to a lesser degree. A combination of Fig. 2 and Fig. 3 is also favorable.

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