Browse Prior Art Database

Separating Semiconductor Devices from Supporting Substrates

IP.com Disclosure Number: IPCOM000079260D
Original Publication Date: 1973-Jun-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Roush, WB: AUTHOR [+2]

Abstract

This fixture facilitates removal of solder-bonded semiconductor chips from the supporting substrate.

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Separating Semiconductor Devices from Supporting Substrates

This fixture facilitates removal of solder-bonded semiconductor chips from the supporting substrate.

The fixture consists of a plurality of pins 10 supported on plate 12. Pins 10 each have an extending portion 14 of reduced diameter and a flat abutting surface 15. In fabricating the module 20, apertures 22 are formed in the area underlying semiconductor chip 24. Semiconductor chip 24 is bonded to substrate 20 by a plurality of solder pads 26.

In operation, the module 20 is deposited on pins 10 with the reduced portions 14 through the apertures 22. Heat is applied until the module temperature reaches approximately 350 degrees C, whereupon the pads 26 will melt allowing the substrate 20 to fall to the stops 15.

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