Browse Prior Art Database

Wafer Spin

IP.com Disclosure Number: IPCOM000079266D
Original Publication Date: 1973-Jun-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Mueller, W: AUTHOR [+3]

Abstract

This wafer spin chuck provides noncontact handling and spinning of semiconductor wafers during liquid treatment operations, such as photoresist application.

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Wafer Spin

This wafer spin chuck provides noncontact handling and spinning of semiconductor wafers during liquid treatment operations, such as photoresist application.

Semiconductor wafers 10, shown in phantom outline, are fed by a standard air track, not shown, to a position over spin chuck 12 formed from a flat plate. Placed around the periphery of chuck 12 and beyond the edges of wafer 10, are a plurality of centering jets 14 which direct air, as shown by the arrows, towards the center of chuck 12. Adjacent each centering jet 14 is a vent hole 16 for exhausting air introduced by centering jets 14. Vertical separation between wafers 10 and chuck 12 is maintained by air applied through four lift holes 18. Spinning of wafers, in either clockwise or counterclockwise direction, is achieved by providing high-pressure air to the proper set of spin jets 20 and 22. Air supplied through spin jets is exhausted through spin vent holes 24. Directional jets 14, 18 and 20 are formed by lancing the top surface of chuck 12 to form angled semicircular shaped tabs, which provide required directionality. Various liquids may be deposited onto the supported wafers and uniformly distributed, by causing wafers to spin at a desired rate of speed.

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