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Adhesive for Bonding Ferrite Parts

IP.com Disclosure Number: IPCOM000079286D
Original Publication Date: 1973-Jun-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hawkins, CR: AUTHOR [+3]

Abstract

An epoxy adhesive is described for temporarily bonding ferrite parts to metal fixtures prior to machining. The adhesive's properties allow parts to be ground, sliced, and lapped under a variety of manufacturing conditions. Application and processing procedure give a very thin bond line which permits close control over part flatness. Adhesive removal is rapid with a safe organic solvent process suitable for subsequent water-base cleaning.

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Adhesive for Bonding Ferrite Parts

An epoxy adhesive is described for temporarily bonding ferrite parts to metal fixtures prior to machining. The adhesive's properties allow parts to be ground, sliced, and lapped under a variety of manufacturing conditions. Application and processing procedure give a very thin bond line which permits close control over part flatness. Adhesive removal is rapid with a safe organic solvent process suitable for subsequent water-base cleaning.

The formulation comprises diglycidyl ether of bisphenol A or epoxy resin having an epoxide equivalent of 1500-3000, of about 100 parts by weight; 50 parts by weight of an epoxy resin having an epoxide equivalent of 175-200; 200- 250 parts by weight ethylene glycol monomethyl ether, and about 0.3 parts by weight of an oil-soluble dye.

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