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Browse Prior Art Database

Solder Reflow Chip Joining

IP.com Disclosure Number: IPCOM000079445D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Jaspal, JS: AUTHOR

Abstract

Solder reflow chip joining is well known in the art, and is described, for example, in U. S. Patents 3,458,925, 3,495,133, and 3,429,040.

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Solder Reflow Chip Joining

Solder reflow chip joining is well known in the art, and is described, for example, in U. S. Patents 3,458,925, 3,495,133, and 3,429,040.

In such chip joining, the chip is joined to the substrate by placing the pads on the chip in contact with coincident pads on the substrate, which are connected to a substrate land pattern. The chip pads are solder. The structure is then heated, whereby the solder pads melt and form electrical as well as structural contact between the chip and the substrate.

For durability, such solder reflow contacts may be enhanced by an additional heating step after the solder reflow step is completed and the structure cooled. In this additional heating step, the structure is reheated to a temperature in the order of 230 degrees C for a time in the order of 20 seconds.

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