Browse Prior Art Database

Positive Photoresist Development Process

IP.com Disclosure Number: IPCOM000079448D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DiFazio, JJ: AUTHOR [+6]

Abstract

Positive photoresists are developed on hydrophylic surfaces using a non-aqueous development system.

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Positive Photoresist Development Process

Positive photoresists are developed on hydrophylic surfaces using a non- aqueous development system.

Diazo ketone sensitized positive photoresists containing phenolformaldehyde polymers are normally developed using aqueous alkaline solutions. When developing such resists on hydrophylic surfaces, such as during the repair of photographic emulsion masks used in integrated-circuit manufacture, resist lift-off occurs due to the swelling of the emulsion layer by the aqueous alkaline developer solution. Such damage is avoided by using a nonaqueous developing system for the positive resist. Suitable developers are isopentyl alcohol, tertiary amyl alcohol and tetramethyl ammonium hydroxide.

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